Wave Soldering Machine
Part No: RDG300DS
SPECIFICATIONS
| ITEM SIZE | 3280 * 1200 *1650mm | PACKAGING SIZE | 3290 * 1210 *1660mm |
| NET WEIGHT | 98.000Kgs | PACKAGING WEIGHT | 120.000Kgs |
| PACKAGING METHOD | Wooden Carton | SHIPPING DATE | 7 Days |
Description
Wave Soldering Machine
Parameters
| PCB plate Adjustable width | Max.50-300mm |
| PCB board transport height | 700±50mm |
| PCB board transport speed | 0-2.0M／Min |
| PCB plate transport angle | welding dip angle 3-7 degrees |
| PCB board transport direction | L→R |
| PCB board component height restriction | Max.80mm |
| Preheating zone length | 1200mm |
| Preheating zone number | 3 |
| Preheating zone power | 9kw |
| Preheat zone temperature | Room temperature -220 C can be set |
| Heating method | infra-red |
| Number of cooling zone | 1 |
| Applicable solder type | Lead free solders |
| Tin furnace | 4mm x 316 stainless steel |
| Power requirements | 9kw |
| Max tin stove capacity | 300KG |
| Solder temperature | Room temperature --300 C, control accuracy of + 1 |
| Temperature control mode | P.I.D+SSR |
| Machine control mode | Touch screen +PLC |
| Flux storage tank | Max5﹒0L |
| Flux flow | 10-100ml/min |
| Spray mode | The US Parker rodless cylinder + Taiwan Mingli nozzl |
| Power supply | 3 phase 5 wire 380V |
| Starting power | Max13kw |
| Normal operating power | Approx.6.0kw |
| 4-7KG | CM2 source |