500g dual Solder Paste Mixer

MIX500D2 slope efficiently and evenly mixes the solder paste to a liquid state. It helps to achieve better results of stencil orienting and reflowing process.The use of the mixer also reduces the chances of absorbing air moisture as it is no longer necessary to remove the lid of the solder paste jar before the paste is actually used in the production.

FEATURE
1、The solder cream jars are placed in 45 angle, and run around its axis line, so the solder cream will not adhere to the jar cover
2、Double security design to sure the safety of operators.
3、The air bubbles can be eliminated while the solder paste is being mixed.
4、The control of the solder paste mixing is considered fully with using special control circuit.
5、The rotating speed has proved by practice, so the impact against the tin power and the effect to solder paste quality in the rising temperature are avoided.

SPECIFICATIONS
Working Power 220V AC(50hz) 60W
110VAC(60hz) 60W(for choose)
Rotating Speed Primary rotating:1000RPM;Sencond rotating:380RPM
Working Capacity 500g*2jar  (please give us bottle diameter for customized)
Tin Pot's Sizes:
M diameterΦ60-Φ67 standard one
S  diameterΦ53-Φ60 (please contact us if you'd like the size)
L  diameterΦ67-Φ74 (for choose, please contact us)
Time Setting 0.1～9.9mins, adjust0.1min per time;
10～30mins, adjust1.0min per time.
Display & Caution LED digital display、light blink and buzzer warning


HIGHLIGHT
The air bubbles can be eliminated while the solder paste is being mixed.